Encapsulated Thermoelectric Modules and Compliant Pads for Advanced Thermoelectric Systems

Abstract

The described encapsulated thermoelectric (TE) module consists of a vacuum-tight stainless-steel container with dimensions of 55 mm × 50 mm × 11 mm in which a SiGe or BiTe TE module is placed. This construction enables maximum performance and durability because: (1) the thermal expansion mismatch between the hot and cold sides of the container can be accommodated by a sliding sheet that is present in the container; (2) the TE module inside is always kept in a vacuum environment so that oxidation cannot occur; and (3) the difference in pressure between the inside and outside of the container reduces the thermal contact resistance inside the container. The design also includes a compliant pad made of porous material that is infiltrated with braze filler material. If heated to a temperature above the melting temperature of the braze filler, the thermal gap conductance of the interface is enhanced due to the strong affinity of the braze filler to an adjacent member. It is possible for this interface to slide as long as the braze filler is in the liquid state. This design strategy provides high-flux, direct conduction paths to the heat source and heat sink as well as a large temperature gradient across the TE module itself (1.7 times that in the case of the conventional design strategy); therefore, the module can provide a power output that is three times greater than that of a conventional module.