Abstract
The potential of Thermo compression Bonding (TCB) has been widely discussed for several years, but it has not previously achieved widespread production use. TCB has now begun the transition to an accepted high volume manufacturing technology driven primarily by the memory market, but with wider adoption close for non-memory applications. Several key factors have enabled this transition, including advanced TCB equipment with higher UPH for cost reduction and advanced methods of inline process control. The unique requirements of TCB demand absolute process control, simultaneous data logging capability for multiple key factors in the process and portability of the process between tools. This introduces a level of sophistication that has not previously been required for BE assembly processes. This presentation will review state of the art TCB technology and the fundamental equipment requirements to support the transition to HVM.
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