Abstract

This numerical paper addresses the effects of using a cooling fluid (H2O) with the presence of carbon nanotubes (MWCNTs - SWCNTs) and micro-sprays aimed at reducing the heat peak of the interior of the electrical system, i.e., enhancing the shelf life of components. The studied process was assessed under steady-state conditions and employing the k-omega (k-ω) turbulence modeling ANSYS-FLUENT software. The simulation is conducted so that the heat flux applied to the electrical system (Diode and IGBT) was on a constant basis. In accordance with the results, it was realized that increasing the volume fraction of nanoparticles (to 5%) causes the thermal diffusivity of the fluid to elevate and ultimately the temperature peak is created in smaller values. Besides, it was deducted that using micro-spray (Case 3) because of its special geometry and dimensions, causes fluid behavior to be created turbulently. This also leads to increasing the generated flow rate; therefore, along the embedded duct, the hydrodynamic effects prevail over the thermal effects and the module temperature is reduced (to 326 K). This transcendental cooling power has caused the performance coefficient (COP) of Case 3 to have the lowest rate relative to Case 1, while the pumping power (Pp) trend is the opposite.

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