Abstract
The authors address the problem of random manufacturing variations in PCB (printed circuit board) structures and describes an empirical technique to perform a statistical analysis of PCB lines. The technique is designed to improve transmission-line characterization by enabling a worst-case analysis of transmission-line effects to be done. This will allow the designer to minimize postprototype problems associated with high-speed PCBs concerning inconsistencies in a manufacturing process. The description of PCB structures is obtained by measuring the scattering parameters and then converting them to frequency-domain characteristic impedance (Z0) and propagation constant (gamma). A deviation in complex Z0 and gamma can be used to model line and discontinuity variations. It is concluded that with the use of this technique, a better representation of Z0 and gamma can be obtained than by previous techniques. >
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