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Abstract
This work presents a numerical modeling of passive intermodulation (PIM) product on contact junction under the multiphysics condition. The carrier power, temperature, and pressure impacts are combined into the model using design of experiment method. Based on several sets of optimized PIM test conditions, an empirical PIM model versus multiphysics can be established. The experiment demonstrates that the proposed PIM modeling method can predict PIM product with the max error of 7 dB.
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