Embedding of electronics within thermoplastic polymers using injection moulding technique

Abstract

This paper reports work from a major UK research project which seeks to develop a cost effective integrated production technology for the manufacture of plastic automotive components with embedded electronics and power distribution. These electronic sub-systems are simultaneously packaged within the automotive structural thermoplastic (TP) component during the injection moulding process. Such innovative process and product integration represents an opportunity to significantly reduce component counts and wiring loom overhead for the vehicle. The assembly, weight and cost advantages envisaged from the proposed technology satisfy the ever-increasing demand for automotive suppliers to manufacture complete, ready-to-assemble, reconfigurable component modules with superior reliability and as such may contribute to the increased incorporation of vehicle telematics.