Abstract
ABSTRACT In this paper, we proposed a technique, ultrafast laser machining–picosecond laser welding, to fabricate an embedded thin film by placing a coating material (ZnO powders) between the interface of two glass substrates. We researched the thickness (embedding depth of ZnO powders) and the formation mechanism of the embedded thin film and the zinc content and distribution. Under our experimental conditions, an embedded thin film of 600 μm thickness was formed. At a distance of 340 μm within the embedded thin film, the zinc content peaked at 400 cps. Finally, we fabricate an embedded thin film with the bonding strength of 12.22 MPa. This technique breaks through the bottlenecks of thin films fabricated by conventional lasers, such as long duration, low precision and serious chemical pollution, which has great significance for achieving high-end manufacturing of thin-film devices.
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