Abstract
A new transformer/inductor technology is introduced which is suitable for integrated power for multichip modules (MCM) and microprocessors. The transformer/inductor is embedded within the ceramic substrate, as are the chips and other components. For core, multipole core structures are employed in order to meet extremely low height requirements. The windings are constructed using high-density interconnect techniques such as laminating dielectric layers and depositing winding metals using sputtering followed by electroplating. Winding patterns are etched using photoresist and wet etching techniques, and multiple vias are used to connect different primary and secondary winding layers. A conformal metal mask is used to laser-drill through (large) holes for the posts of the top part of the core. An experimental 50-W, six-pole embedded transformer is described. It operates at 1.0 MHz with an efficiency approaching 98.7% and has a net height of less than 0.09 in. It provides for extremely tight secondary side circuit layouts with very low and fixed leakage inductance.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
