Abstract
In this paper. we present a novel ultra-compact embedded IC integration approach for System-On-Package (SOP) based solutions for RF and wireless conununication applications. Tlus concept is applied to the integration of a Ku band VCO module. The module fabrication is described and the impact of the packaging on the chip-set perfonimces is discussed. The final thickness of the module is the tlu~cst reported till date and is about only I50 win. The embedded VCO exhibits an oscillation frequency of 15.4 GHz, a phase noise of -99.2 dBcMz at a 1 MHz offset and inaxinnnn output power of 10.67 dBm. Multi-layer interconnects built with inodified MCM-D technology using advanced photosensitive cpoy InteniaT8000 is described. We also present a detailed chmcterization and inodeling of RF inductors. They exhibit a quality factor as high as
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
