Abstract
Biphenyl epoxy/phenol-aralkyl resins with a high silica content were cured by synthesizing and using a novel organophosphine accelerator, triphenylphosphine-1,4-benzoquinone (TPP-BQ), which exhibits thermal latency. Thermal properties and curing characteristics of epoxy molding compounds (EMCs) that were accelerated by TPP-BQ and triphenylphosphine (TPP) were also studied using a differential scanning calorimeter (DSC). Although an analysis of thermal characteristics revealed that TPP-BQ is inactive at low temperatures, at high temperatures, TPP-BQ increases the curing rate of EMC in dynamic and isothermal curing experiments. Additionally, EMCs containing TPP-BQ exhibited excellent storage stability and swift hardening characteristics, owing to the effect of the thermal latency of the accelerator on the molding behavior of the EMCs. Before gelation, EMC containing TPP-BQ had a lower melting viscosity than that of EMC containing TPP, explaining why the former flowed longer in the spiral flow test than the latter.
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