Abstract
Successful metal liftoff requires a retrograde photoresist profile, or one created using a bi-layer process. Coupled with an evaporator setup for liftoff deposition, these ensure a discontinuity in metal coverage so that the unwanted field metal can be lifted off cleanly, without tearing or defects. An evaporator with an optimized liftoff configuration necessitates precise source-to-substrate alignment or defects will result. While a lot of development work has been reported on photoresist processes and liftoff techniques, a lack of publication on ideal evaporator geometry and proper setup suggests that the effects of source to substrate alignment have seldom been investigated or discussed. An evaporant flux with precise normality is essential to achieving clean metal liftoff. This paper examines how evaporator geometry influences the liftoff process. We will reveal the working principle of a special alignment tool and how the tool is used to keep the evaporator in precise alignment
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