Abstract
Electrothermal analogy allows a resistive or RC network to be used for simple and convenient thermal analysis; however, it is only valid when heat transfer is purely convective or conductive. We investigate the analogy when a chip's operating environment is not purely convective, e.g. convective atmosphere with some source of heat flux, which is typically the practical case. We mathematically show that the analogy can be extended to such an environment, but with some modifications in a resistive network.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
