Abstract
The electrostatic force between a conductive ball on a plane electrode and a cylindrical electrode with a hemispherical tip is analyzed. A cylindrical electrode with a dielectric film for realizing a new LSI bonding system is proposed. The force on the ball increases with increasing diameter of the cylindrical electrode. When a dielectric film is placed under the cylindrical upper electrode with a fixed gap between the electrodes, the force acting on the ball increases with increasing dielectric film thickness. Capture of the ball was experimentally confirmed. This study provides a useful foundation for electrostatic manipulation of a conductive ball. ► The electrostatic force on a conductive ball between electrodes is analyzed. ► Electrode with a dielectric film for realizing a new LSI bonding system is proposed. ► The force on ball increases with increasing diameter of the cylindrical electrode. ► Force on ball increases with increasing film thickness adjacent to upper electrode. ► Provides an useful foundation for electrostatic manipulation of a conductive ball.
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