Abstract
Abstract We present a method of metallic nanoparticles (mNPs) deposition from water-based colloid onto solid substrates via electrospray technique. Gold nanoparticles (AuNPs) with the size of about 13 nm were synthesized in water via chemical reduction method and characterized with UV–vis spectroscopy, dynamic light scattering (DLS), and atomic force microscopy (AFM). AuNPs were deposited via electrospray onto two solid substrates: silicon wafer and element of resistive memory device and characterized with scanning electron microscopy (SEM). Studies confirmed that electrospray technique can be successfully used for mNPs deposition from aqueous colloids on solid substrates without altering the substrate structure. During the electrospray process the solvent that may destroy the surface of resistive memory element evaporates and mNPs are deposited in dry conditions. The presented method is versatile and can be used for the deposition of different nanomaterials onto various types of solid substrates.
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