Abstract

Recycling of the impure tin generated by the hot dip tinning and wave soldering technologies widely applied in modern electronic industry can be carried in a flexible and economical way even at relatively low production rates by electrorefining. In order to avoid the economical disadvantages of the alkali stannate or the sulphuric acid – cresylic phenylic sulphonic acid baths, the hydrochloric acid tin chloride electrolyte solutions can be applied. The major difficulties of solution stability, cathode corrosion and rough electro-crystallization can be overcome by optimizing the solution composition and the current parameters. Strong chloro – complex formation in the hydrochloric acid solution enhance stability of the Sn(II) species and the consequent natural inhibition promotes a cathodic deposition of acceptable quality. The virtual current efficiency and the morphology of electro-crystallization were improved by applying periodically reversed (PCR) current. Although cathode corrosion could be depressed to a negligible level, dendritic crystal growth remains to be dominant, therefore special cell arrangement and cathode handling should be applied. The cathode deposit is easily removed and melted, allowing to obtain a recycled tin of high purity.

Highlights

  • The rapidly developing electronic industry produces a growing amount of basically lead free tin containing waste material

  • The rough dendritic nature of cathodic deposition from acidic electrolytes is usually related to high exchange current densities and a relatively slow mass transfer [5]

  • Corresponding to the high exchange current density, the cathodic deposition in the copper electrolyte solution has a strongly needle – dendritic nature, growing mostly at the edges, while tin is deposited in larger crystals, growing in a more dispersed planar, spongy morphology

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Summary

Introduction

The rapidly developing electronic industry produces a growing amount of basically lead free tin containing waste material. The stability of the electrolyte solution may be endangered by the oxidation of the Sn(II) species allowing stannic acid precipitation or re-dissolution of deposited tin.

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