Abstract
A new process for fabricating reflection masks for soft X-ray projection lithography (SXPL) using an electroplating method was developed. Resist patterns were formed on molybdenum/silicon (Mo/Si) multilayers with the Mo layer on top, and nickel (Ni) absorber patterns were then electroplated on the multilayers using the top Mo layer as the electrode in nickel sulfamate solution. Subsequently, the resist patterns were removed. Using the reflection masks fabricated by the above process, SXPL was performed using 1/32 reduction Schwarzschild optics tuned to the wavelength of 13 nm and the synchrotron radiation source at SORTEC. Line-and-space patterns down to 0.1 µ m were printed in polymethylmethacrylate (PMMA) resist.
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