Abstract
The mounting of diamonds using the electroplated deposition of copper was originally developed to hold diamonds in place during polishing. This article describes the extension and application of this method for the mounting of diamonds inside diamond anvil cells. The novel method described, unlike more traditional gluing or clamping methods, can withstand both continual thermal cycling and provide a small profile such that it can be used in miniature cells to permit ample space for fitting electrical feed throughs or external coils around the anvils. The method is developed such that it can be used to attach the diamond to nonmetallic backing plates such as sapphire. Details of precautions to reduce the production of eddy currents in the deposited copper when performing ac-susceptibility measurements are also described.
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