Abstract

采用基于密度泛函理论的第一性原理方法研究了3d过渡元素Cu掺杂及(Cu+N)共掺杂于锐钛矿相TiO 2 (001)面和(101)面的电子性质, 给出了不同掺杂形式形成能、能带结构、态密度及电荷分布的变化, 得出了(Cu+N)共掺杂时最稳定的结构. 通过计算Cu表层吸附、表层和次表层替位掺杂以及晶体间隙掺杂的形成能, 发现Cu掺杂更易发生在TiO 2 (001)面的空穴位, 此时N偏向于在水平方向上的O位发生替位掺杂. 计算结果表明(Cu+N)共掺杂后Cu-3d与O-2p, N-2p及Ti-3d轨道上的电子发生p-d杂化效应, 引发O-2p, N-2p态发生劈裂使得价带范围扩大, Ti-3d态下移且发生劈裂形成新的导带底, 并且禁带中产生了新的电子态, 禁带宽度减小, 同时(Cu+N)施主受主杂质对的出现可以有效防止电子空穴对的复合, 提高了TiO 2 的光催化活性.

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