Electronic Quality Improvement of Highly Defective Quasi‐Mono Silicon Material by Phosphorus Diffusion Gettering

Abstract

Quasi‐mono silicon (QM‐Si) attracts interest as a substrate material for silicon device processing with the promise to yield single‐crystalline silicon quality with multicrystalline silicon cost. A significant barrier to widespread implementation of QM‐Si is ingot edge‐contamination caused by the seed material and crucible walls during crystal growth. This work aims to recover the scrap material in QM‐Si manufacturing with a process easily adaptable to semiconductor device manufacturing. A phosphorus diffusion process at 870 °C for 60 min significantly improves the electronic quality of a QM‐Si wafer cut from a contaminated edge brick. The harmonic minority carrier recombination lifetime of the wafer, a key predictor of ultimate device performance, experiences a tenfold increase from 17 to 178 µs, which makes the scrap QM‐Si material usable for device fabrication. Local areas with suboptimal (<50 µs) lifetimes remaining can be further improved by a high temperature anneal before the phosphorus diffusion process.