Electronic and chemical properties of the TaN/a-SiOC:H stack studied by photoelectron spectroscopy for advanced interconnects

Abstract

Thin TaN metallic barriers are used to prevent copper diffusion into porous low-k dielectrics such as a-SiOC:H for advanced interconnects. We investigate the detailed electronic properties of the TaN/a-SiOC:H stack. Here we combine ultraviolet and x-ray photoelectron spectroscopy to measure the chemical composition and the whole band diagram of the TaN/a-SiOC:H stack. An original interpretation based on the image-force model used for internal photoemission is suggested to explain the electric field effect induced by negative bias of a-SiOC:H. This model is used to extrapolate the unbiased electron affinity of the dielectric. TaN work function, a-SiOCH band gap, valence band maximum and electron affinity of 4.6, 7.7, 4.0, and 3.8 eV are respectively obtained. Kelvin force microscopy and spectroscopic ellipsometry confirm TaN work function and a-SiOC:H band gap measurements, respectively. From the full band diagram of the TaN/a-SiOC:H stack, an interfacial barrier height of 0.8 eV is deduced.