Electronic and atomic structure modifications of copper nitride films by ion impact and phase separation

Abstract

We have studied electronic and atomic structure modifications of Cu 3N films under 100 keV Ne and 100 MeV Xe ion impact. Cu 3N films were prepared on R(11–2 surface)-cut-Al 2O 3 substrates at 250 °C by using a RF-magnetron sputter deposition method. X-ray diffraction (XRD) shows that unirradiated films are polycrystalline with (1 0 0) orientation of cubic structure. We find that the electrical resistivity (∼10 Ω cm before ion impact) decreases by more than two orders of magnitude after the Ne impact at a fluence of ∼10 13 cm −2, where no Cu phase separation is observed. For further ion impact (larger than ∼10 15 cm −2), XRD shows Cu diffraction peak (Cu phase separation), and the resistivity decreases further (three orders of magnitude). Decomposition and phase separation are discussed based on these results, as well as temperature dependence of the resistivity and optical absorption. The results of 100 MeV Xe ion impact are compared with those of Ne ion impact.