Abstract

Surface scattering is a major issue in thin Cu films at reduced scales. The rise in the diffusive scattering due to the surface roughness causes the electrical resistance to increase remarkably. In this paper, graphene, as opposed to Al and Pd, is considered as a liner layer for thin Cu film with low-surface roughness using first principles calculation. The surface roughness is simulated using the nonequilibrium coherent potential approximation combined with the linear muffin-tin orbital formulation. The coherent potential approximation band structure shows that the graphene $\pi $ -bands is not significantly affected by the surface disorder at the Cu surface and that graphene acts as a parallel path to the electrons. On the other hand, the bands of Cu–Al/Pd around the Fermi level are substantially broadened due to the surface disorder. Moreover, the graphene-coated Cu shows less electrical resistance than Al/Pd-coated Cu for surface disorder $x\lessapprox 5$ % for thin films with 0.245 nm in width, and 1.23 nm in thickness. The enhancement in the transport properties in Cu–Gr is attributed to the weak electronic interaction at the interface. The obtained results suggest that graphene is better than Al and Pd as a liner material for thin Cu films.

Highlights

  • At reduced scales, electron transport faces many challenges including electron surface scattering, electron grain boundary scattering, surface roughness scattering, impurity scattering and electron phonon scattering [1], [2].These scattering mechanisms cause an increase in the electrical resistivity and give rise to reliability issues [3]–[5]

  • The band structure is calculated for a bulk system using the coherent potential approximation-linear muffin-tin orbital (CPA-linear muffin-tin orbitals (LMTO)) method as will be shown later

  • The band structure can still be obtained through coherent potential approximation (CPA) band structure

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Summary

INTRODUCTION

Electron transport faces many challenges including electron surface scattering, electron grain boundary scattering, surface roughness scattering, impurity scattering and electron phonon scattering [1], [2].These scattering mechanisms cause an increase in the electrical resistivity and give rise to reliability issues [3]–[5]. The capping material may fill the gaps in the rough surface leading to less diffusive scattering [1]. Other materials including Pt [1], Zr and Hf [18] were found to increase the resistivity and cause the scattering at the surface to be completely diffusive. Two-dimensional materials (2D-materials) such as graphene and hexagonal boron nitride have been considered before as a capping material for Cu surfaces These 2-D materials possess unusual properties that can enhance the electrical conductivity and prevent oxidation. Graphene coating decreased the resistance of a rough Cu surface by reducing the surface roughness scattering effect [30], [31]. Al and Pd are known to enhance the conductivity of Cu. graphene is found to show more specular scattering and lower electric resistance for low surface roughness.

THEORETICAL MODEL
BAND STRUCTURE
CONCLUSION
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