Abstract
Pulsed laser deposition (PLD) has been proposed several years ago as a suitable technique to deposit a pure Mg film over a radio frequency (rf) gun Cu backflange in order to obtain a high efficiency photocathode surface for the generation of high brightness electron beams. In this paper we report preliminary experimental results on the emission properties of a PLD grown Mg film within the high electric field gradients of a rf gun showing the effects of the rf conditioning process on the cathode surface. Even though a laser cleaning process should be performed on the sample surface in order to remove contaminated layers, the results presented here are very promising for the realization of a final Mg-based photocathode.
Highlights
Electron injectors for advanced projects such as fourth generation x-ray FEL sources [1], and for future linear colliders [2], are most commonly based on laser excited photocathodes located in high field guns
In this paper we report preliminary experimental results on the emission properties of a Pulsed laser deposition (PLD) grown Mg film within the high electric field gradients of a rf gun showing the effects of the rf conditioning process on the cathode surface
In this article we report the results of the first power tests of a PLD deposited film used as a photocathode in an rf gun
Summary
Electron injectors for advanced projects such as fourth generation x-ray FEL sources [1], and for future linear colliders [2], are most commonly based on laser excited photocathodes located in high field guns. The main requirements on the cathodes are high quantum efficiency, promptness of response, emission uniformity over the irradiated surface, and stability (lifetime). Mgbased photocathodes have been the most studied due to their respectable quantum efficiency [4]. When tested in the very high electric fields of a rf gun, the sputtered Mg films have been found to be seriously damaged by discharges during rf conditioning [5]. This has been ascribed to the poor quality of the film, especially regarding uniformity and adhesion to the Cu substrate
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