Abstract
The microstructure evolution of electroplated copper films was characterized by electron backscatter diffraction (EBSD). Special care was taken during the preparation of the cross-sectional specimens and microstructure analysis to obtain reliable results. The film exhibited a columnar grain structure with a large fraction of twin boundaries. Annealing induced normal grain growth and caused many of the general highangle grain boundaries to be replaced by twin boundaries, possibly by annealing twinning. [doi:10.2320/matertrans.MG200910]
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