Abstract
The electromigration that occurs in a Cu/Sn-9Zn/Cu sandwich was investigated for void formation at room temperature with 103 A/cm2. A focused ion beam revealed that voids nucleated at the intermetallic compound (IMC)/solder interface regardless of the electron flow direction. The needle-like voids initiated at the cathode Cu5Zn8/solder interface due to the outward diffusion of Zn atoms in the Zn-rich phase and expanded as a result of the surface diffusion of Sn atoms upon current stressing.
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