Electromigration in sputtered Al-Cu thin films

Abstract

Lifetime predictions for aluminum metallization vary considerably depending on many factors. These include the deposition scheme and resulting microstructure of the film, linewidth and geometric variations, alloying elements and testing procedure. Many experimental techniques have been used to study metallization lifetimes. Most involve mass transport measurements in both bulk and thin film samples. A method has been developed for lifetime predictions using a continuous resistance monitoring technique. This allows for lifetime measurements that are more sensitive and, consequently, more accurate than present techniques.