Abstract
Electromigration (EM) has been a pivotal reliability challenge for interconnects, but there are only few studies on EM in Cu–Cu joints. In this work, accelerated EM tests for the Cu–Cu joints were conducted at three temperatures (150 °C, 179 °C, and 208 °C) and the temperature-dependent failures were discussed. The polarity effect of the grain growth behaviors at the bonding interfaces was observed at the opposite electron flows, which may be attributed to the difference in EM-build-up stress conditions and the divergence in atomic fluxes. Moreover, the activation energy (Ea) extrapolated from the three EM temperatures was derived as 0.9 eV. As compared to the solder joints with same dimensions, the Cu–Cu joints possess more than ten times of time-to-failures (TTFs) under the same EM condition.
Published Version
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
