Abstract
This study aims to investigate the interfacial reactions of Sn-58Bi/Cu and Sn-58Bi/Cu-Zn solder joints during liquid-solid electromigration (L-S EM). L-S EM behavior of Sn-58Bi/Cu and Sn-58Bi/Cu-2.29Zn solder joints about external microstructure under 1.5 × 104 A/cm2 at room temperature was studied using scanning electron microscopy (SEM). For the two types of solder joints, the thickness of IMC layer at the anode side was much higher than that at the cathode side with the same stressing time, respectively. At the anode side of Sn-58Bi/Cu and Sn-58Bi/Cu-2.29Zn solder joints, the rod-like Cu 6 Sn 5 grew rapidly and showed an obvious “Ripening phenomenon”. It is also found that doping 2.29Zn into Cu substrate reduced the average thickness of IMC layers at both sides. The “Ripening phenomenon” happened in the two types of solder joints, which indicated that the doping Zn did not change the direction of Cu atoms. There was no back-stress in L-S EM, and the flux induced by EM and chemical potential gradient during L-S EM was discussed.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
