Abstract
With the huge requirement of high frequency, multi-function and high reliability, the quality of microwave circuit interconnection has become an important factor that significantly affects the improvement of microwave electronic system performance. This paper has presented an identification method for flexible conductor wire interconnection (FCWI) electromechanical coupling parameters in microwave circuits with the consideration of their interaction effect. First, a parametric characterization cascade function has been proposed to design the FCWI, and consequently, a three-dimensional electromagnetic structure model of FCWI has been developed and verified. In order to identify the electromechanical coupling parameters of the flexible interconnection considering the interaction effect effectively, this paper has used the range multi-objective function to select the optimal level of the configuration parameter of the flexible interconnection that affects the signal transmission loss. Based on the variance analysis and range analysis of the experimental results, the comprehensive judgment criterion of electromechanical coupling parameters of flexible interconnection can be defined, and therefore, the calculation of electromechanical coupling degree can be derived and the electromechanical coupling property identification of flexible interconnection has been obtained. An example has been used afterwards to verify the accuracy of the proposed method. The method proposed in this paper can be a promising tool for microwave circuit comprehensive design and the optimization of its interconnection, considering both mechanical reliability and electrical performance.
Highlights
Microwave circuits are widely used in the fields of Internet of Things (IOT) communication, radar detection, electronic countermeasures and so on
The interconnection configuration will be forced to deform under the influence of the environmental stress load, which will further affect the electrical signal transmission
In order to improve the quality of microwave circuit development, the impact of the circuit interconnection on signal transmission should be considered
Summary
Microwave circuits are widely used in the fields of Internet of Things (IOT) communication, radar detection, electronic countermeasures and so on. As the key component of a high frequency electronic system, the development of the microwave integrated circuit is developing towards high speed, high reliability, multi-function and miniaturization [1,2,3]. On one hand, with the increase in the electromagnetic transmission frequency, the influence of the structure of the microwave circuit interconnection on the signal transmission is becoming more and more intensified. The interconnection configuration will be forced to deform under the influence of the environmental stress load, which will further affect the electrical signal transmission. Mechanical reliability problems in the process of design, manufacture and operation of the microwave circuit interconnection can directly cause circuit function failure [6]. In order to improve the quality of microwave circuit development, the impact of the circuit interconnection on signal transmission should be considered
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