Abstract
The rapid development of electronic equipment makes the study on electromechanical coupling problem (EMCP) a new research area. The electromechanical coupling analysis is a multidisciplinary problem mainly involving the structure, electromagnetics and thermology. To begin with, the methods of calculating three fields are presented involved in EMCP, which is followed by the coupling relation. Then, the electromechanical coupling modeling is developed of the typical electronic equipment including the reflector antenna, planar slotted antenna, active phased array antenna, and high-density packaging system. Simultaneously, the engineering applications of the electromechanical coupling model are discussed with useful results to validate the coupling model proposed.
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