Abstract
In order to study electrical properties, especially the electromagnetic interference (EMI) shielding property of ternary Ni-P-Cu plated polyether ether ketone/carbon fiber composites (CFs/PEEK) and their dependence on Cu content of the coating, electroless Ni-P coating was first deposited on CFs/PEEK to obtain the optimum conditions for deposition rate, then a small quantity of CuSO4•5H2O (0.1∼0.4 g/L) was added in the electroless nickel-based alloy plating (ENP) bath to investigate the influence of Cu content on the deposition rate and coating characterizations. The EMI shielding effectiveness (SE) was evaluated and corrosion resistance was characterized by electrochemical polarization measurement. It was found that coating phase change from amorphous to a mixture of amorphous and microcrystalline phases with the increase of Cu2+ concentration. Due to the neat morphology and uniform amorphous structure, the optimum coating Ni-P-2.2 wt% Cu obtained at the 0.2 g/L Cu2+ in the bath owns the best corrosion resistance, EMI SE and the lowest surface resistance. POLYM. COMPOS., 36:923–930, 2015. © 2014 Society of Plastics Engineers
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
