Abstract
Copper/bamboo fabric (Cu/BF) composites were prepared by electroless deposition via a tin-free process. The process involved 3-aminopropyltrimethoxysilane modification, noble metal (Au or Pd) activation and electroless copper planting of BF. The copper deposition rate via Pd catalytic process was 1.01mg/cm2h, higher than that by Au catalytic process (0.85mg/cm2h). The microstructure of Cu/BF composites was analyzed by scanning electron microscopy (SEM), and the copper coatings were composed of ball-shaped copper particles. The composition and chemical state of copper layers were measured by X-ray diffraction (XRD) and X-ray photoelectron spectroscopy (XPS) spectra, Cu0 was detected but copper dioxide was not found in both spectra. The electromagnetic interference, water absorption, mechanical tension, conductivity and adhesion properties of Cu/BF samples (weight ratio of Cu/BF: 0.36±0.01) were measured to obtain the qualities of the composites.
Published Version
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
