Abstract
This paper proposes an advanced microstructure embossing replication technology that combines an electromagnetic-field-aided magnetic soft mold and a reverse imprinting technology to replicate microstructure. The main advantage of this technology is low pressure, low cost, and quick and easy forming. The entire imprinting process can be completed at room temperature using a ultraviolet (UV) curing technique. This study applied a compound casting technique to fabricate a magnetic poly(dimethylsiloxane) (PDMS) soft mold, with an electromagnetic chuck for even imprinting pressure, and reverse imprinting molding technology. Microstructure cavity of the mold was fully filled with photoresist before imprint replication, and improved microstructure transfer ratio. Examination of the results showed that, the magnetic PDMS soft mold integrated electromagnetic-field-aided reverse imprinting process developed by this study, can successfully replicate microstructure at room temperature, low pressure, and avoid deformation and residual stress problems due to heating and cooling.
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