Abstract
Electrolytic deposition of metals on semiconductor electrodes was studied by a potentiostatic pulse method. Experimental data for the deposition of Pb, Ag, and Pd on , , , , and are analyzed to obtain information regarding the mechanism of deposition and the structure of the deposits. The results suggest that the actual overpotential required for the deposition of a metal depends on the relative position of the redox potential of the metal with respect to the flatband potential of the semiconductor while the nucleation behavior of the metal is influenced by the difference in work functions of the depositing metal and the substrate.
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