Abstract
Electrolytic metal migration is a mechanism which causes failure in microelectronic devices. This failure mechanism results in dendritic growths which bridge the electrode spacing between adjacent conductors on an insulating substrate and produce electrical failure. Accelerated life tests have been developed to study and characterize metal migration. The accelerated life test for this investigation consists of a doped aqueous/polyethylene glycol solution placed across a biased copper electrode pair. A chemical cleaning procedure is used to provide a reproducible copper electrode surface. The short‐time (an indication of the rate of copper dendritic growth) is dependent on the electrode configuration (plane‐to‐plane, point‐to‐plane, or point‐to‐point), the electrode spacing (0.05–0.25 mm), the applied potential (2–12V), the ammonium perchlorate electrolyte concentration (0.45–23.0 mm), the water concentration [48–85 mole percent (m/o)], and the temperature (21°–50°C). The short‐time is independent of either fiberglass, alumina, or polyimide substrates. The total charge (the integrated current to failure) corresponding to the short‐time data is dependent on the electrode configuration, the electrode spacing, the applied potential, and the electrolyte concentration. The total charge is independent of the water concentration and the temperature.
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