Abstract
In this study, rhenium–nickel (Re–Ni) films were formed by electroless deposition on conductive (Cu) and non-conductive (SiO 2) substrates. Different bath compositions were evaluated, aiming to achieve high Re-content. Both sodium hypophosphite and dimethylamine-borane were used as reducing agents. Films containing up to 75 at% Re were obtained. The influence of nickel concentration in the solution on alloy composition, deposition rate and surface morphology were determined. It is shown that Ni 2+ acts as a catalyst for the in situ reduction of the perrhenate ion, in a manner similar to what was proposed for electroplating of the same alloy. The rate of electroless plating is similar to that found in electroplating at an applied current density of 50 mA cm −2. While pure Re cannot be deposited from our electroless plating baths, the addition of even a very small amount of Ni 2+ ions (0.25 mM) is enough to start the induced codeposition of Re. Proper selection of the bath composition can lead to fine control of the alloy thickness and its Re-content, thus making it potentially attractive for thin barrier layers.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
