Abstract
Electroless nickel plating in solutions containing acetate, lactate, citrate and glycine as ligand has been studied at pH 4·5. A decrease in nickel plating rate and an increase in P amount incorporated into the coatings have been found to be proportional to the increase in stability of Ni2+ ions complexes with organic acids ions. 0·2 mM CuSO4 sufficiently stabilises all the studied electroless plating solutions and increases the nickel plating rate. The presence of dicarboxylic acid (malonic, succinic or adipic) along with Cu2+ in the plating solution increases the NiP plating rate, hypophosphite utilisation efficiency and decreases coatings roughness, they become brighter and smoother. These effects are more pronounced if dicarboxylic acid of higher molecular weight is used as an additive.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
