Abstract
Compact electronic devices are created primarily using fine patterning technology. Electroless Ni-P/Au plating plays an important role in the metal finishing for these printed circuit boards. In this study, we evaluated new additives containing high-valent metal ions for electroless Ni-P plating to improve pattern forming ability. Conventional additives have caused step plating or poor corrosion resistance. But the addition of high-valent metal ions could prevent these problems. Also, our research indicates that the addition of Co3+ could most effectively prevent deposition on the area surrounding the pattern. We suppose that Co3+ reduces to Co2+ on Pd residues preferentially to the deposition of Ni. Therefore, deposition on the area surrounding the pattern can be prevented by the addition of Co3+.
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