Abstract
Methods for catalytic activation followed by electroless metal plating have been developed for their potential use for 2.5D and 3D Through - Si Vias (TSVs) packaging applications. SiOx and TiOx nanolayers with catalytic Pd particles have been deposited that are low in thickness (< 30nm) and roughness (< 2nm). Metal (Ni or Co) has been electrolessly plated with P and W to ensure low roughness and aid in limiting inter-diffusion between the metal barrier-seed layer and electroplated copper. Electroless Co or Ni films containing over 12% P and 2% W provided an effective barrier layer. These methods could be also applied to Through - Glass Vias (TGVs) substrates.
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