Abstract
A laminate of silver/atomic layer deposition TiN/Si was prepared to research the thermal reliability. The atomic layer TiN was subjected into different kinds of plasma to modify its surface chemistry. The surface tension of the TiN/Si surface was found to be reduced by O2 plasma bombardment. The reaction mechanism of the continuum of silver film was also explored in this paper.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.