Electroless Deposition of Copper Nanostructures in Aqueous Solution

Abstract

This paper reports a simple and low cost process for the synthesis of various Cu nanostructures by electroless deposition. Oxidation-stable Cu nanoparticles and nanowires were prepared in aqueous solution in the presence of protective agents. When gelatin is used as protective agent, only spherical Cu nanoparticles with a mean diameter in the range of 37 to 44 nm are formed in the solution. Smaller nanoparticles are prepared at a higher concentration of gelatin. When ethylene diamine is used instead of gelatin, one-dimensional growth of Cu nanowires is favored. Varying the amount of EDA and gelatin provides morphological control over the nanostructures.