Abstract
The electroless copper plating on non-conductive glass substrates by nano-silver activation was studied instead of the conventional two-stepped pre-treatment processes (SnCl2 sensitization and PdCl2 activation). The glass substrate was prepared by polishing with 400 grit silicon carbide abrasive paper and then activated by dipping into Ag(I)-benzoxanine solution to obtain the dispersed nano-silver particles on the surface. The results from SEM, XRD, XRF and TEM illustrated that nano-metallic Ag was successfully prepared and coated on glass substrate. The nano-silver activated glass substrates were then used to study the following parameters: plating time, temperature and concentration of additive gelatin. According to SEM and AFM observation, the Cu film was uniformly grown, smooth and dense of particles. The crystallized sizes of silver and copper on the substrate were calculated by Scherrer's equation, and found to be 45 and 85nm, respectively. In addition, the adhesion of the deposited copper was conducted by using the tape-test technique according to ASTM D3359-02.
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