Electroless copper plating mechanism of mesophase pitch-based carbon fibers by the grafting modification of silane couple agents

Abstract

Electroless copper plating mechanism of mesophase pitch-based carbon fibers (CFs) by the novel silane couple agents (SCAs) sensitization method was investigated based on the three different functional groups of SCAs (KH550, KH570, KH792). The results showed that relatively stable oligomer films could be formed on the surface of CFs after the sensitization treatment with three kinds of SCAs, which promoted adhesion of CFs with copper plating. Besides, a larger crystalline size, lower resistivity, more uniform and continuous coated copper layers were observed in the copper-plated CFs with KH550 grafting modification (Cu@CF-KH550), in comparison with the copper-coated CFs prepared with KH570 or KH 792 grafting modification (Cu@CF-KH570, Cu@CF-KH792). Moreover, Cu@CF-KH550 had the higher thermal stability than Cu@CF-KH570 and Cu@CF-KH792.