Abstract
This paper reports the study of super-gravity effects on electroless copper coating on nickel substrate. The plating rates were obtained versus varying super-gravity accelerations and two super-gravity directions by thickness measurement of Cu coating. Composition and morphology of the coating were measured by XRD and SEM analysis. The use of super-gravity field during electroless copper plating can increase the plating rate and enlarge the size of Cu crystal grain. Coating surface vertical to super-gravity can obtain better coating than in position whose surface parallel to super-gravity.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
