Abstract
Using a resistometric technique electrodiffusion of solid solution copper alloys with small additions (0.8–1.0 at.%) of Sn, Sb and Ni was investigated. When direct current is passed through the alloys, Sn, Sb and Ni are transported towards the anode. The “effective valence” z ∗ of the solute ions was calculated using known tracer diffusion data and neglecting correlation effects. Values obtained for z ∗ are considerably larger than predicted by Huntington's theory. Furthermore, an exponential temperature dependence of z ∗ is observed for Ni. Different correlation factors for tracer-diffusion and electrodiffusion in the case of Sn and Sb could possibly account for the discrepancy between experimental and theoretical values of z ∗ . Electrotransport of Ni in Cu is believed to occur by a dislocation pipe mechanism.
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