Abstract
due to H2 evolution. 4‐6 An electroplating method with supercritical carbon dioxide (scCO2) emulsions (EP-SCE) has been reported to be effective in eliminating defects formed in plated materials. 7 ScCO2 has low viscosity and zero surface tension. Moreover CO2 is non-polar, so it has miscibility with H2. Therefore, the removal of H2 gas bubbles from surface of cathode is enhanced to allow fabrication of uniform and void-free plated films. EP-SCE is expected to be effective in elimiating voids formed in the plated Sn films since the voids are usually formed by H2 gas bubbles, and scCO2 emulsions are very effective in the removal of H2 gas bubbles. In this study, Sn films would be fabricated by CONV and EP-SCE using the same stannous chloride-based electrolyte to investigate the effects of EP-SCE on the morphology and current efficiency on plated Sn films.
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