Abstract
Electrodeposited Ni–SiC composite deposits with SiC were produced on copper substrate using a non-aqueous organic solvent. -Methylformamide was found to be the most suitable solvent as it has a high dielectric constant (182) that allows high tolerance of the electrolyte in the bath, which is ordinarily not obtained in other solvents. The optimum condition arrived for deposition was nickel acetate , boric acid , SiC , current density , duration of electrolysis , and bath temperature . Satisfactory bright composite deposits were obtained, which were quite adherent to the copper base. Scanning electron microscope, energy-dispersive analysis by x ray, and X-ray diffraction studies have been performed to characterize the composites. Effect of current density on composition and microhardness of the composite deposits was investigated. Also, the effect of annealing on the microhardness of the deposits was studied.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
