Abstract
WO 3 hardly dissolved in ZnCl 2–NaCl–KCl (0.60:0.20:0.20, in mole fraction) melt at 250 ° C. The solubility of WO 3 increased by the addition of KF to the melt, which enabled electrodeposition of metallic tungsten. A smooth and fine film of metallic tungsten was obtained on a nickel substrate by the potentiostatic electrolysis at 0.06 V versus Zn(II)/Zn. The thickness reached ca. 2.5 μ m after 6-h electrolysis. The surface of the nickel contact probe pin manufactured by the conventional LIGA (Lithographie-Galvanoformung-Abformung, German abbreviation) process was successfully coated with a smooth and adhesive tungsten film by using this melt.
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