Abstract
Electrodeposition of SnAg alloy films and the effect of additives like PEG-600 and hydrazine hydrochloride on the same were studied in KI–K 4P 2O 7 solutions. PEG-600 was found to adsorb on the electrode surface, resulting in strong reduction inhibition of tin pyrophosphate complex ions, but it does not affect the reduction of silver iodide complex. It was found that hydrazine hydrochloride acted as a reducing agent for Sn 4+ species and greatly improved surface morphology and roughness of the films by preventing the formation of Sn dendrites during electrodeposition. Eutectic Sn 96.5Ag 3.5 was obtained from a plating solution that contained both PEG-600 and hydrazine hydrochloride as additives, at the deposition current density of 40 mA cm −2. Stress measurements of the SnAg films showed that it was tensile. X-ray analysis of the deposit showed the presence of β-Sn and ɛ-Ag 3Sn phases in the eutectic SnAg film. The DSC profile of SnAg film gave the melting point as 222 °C.
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