Abstract
The electrodeposition of Cu2+ in the presence of Ni2+ in a sulfuric acid system was investigated using conventional electrochemical techniques and scanning electron microscopy. The Ni2+ had a hindering effect on the mass transfer of Cu2+, while increasing the temperature and H2SO4 concentration weakened this negative effect. The “S2−” could be hydrolyzated from thiourea and reacted with “Cu2+” and “Ni2+” to form copper sulfide and nickel sulfide, respectively, which obviously increased the charge transfer resistance and refined the particle size of the copper deposit. In addition, the nucleation model of the Cu deposition was changed from instantaneous nucleation and mixed nucleation to progressive nucleation in the presence of thiourea at 4 mg/L.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
